custom AI silicon - Business-News-Today.com

🧬 Interested in pharma, biotech and medical device news? Visit PharmaDeviceNews.com →

Business news, market intelligence, and global industry analysis.

The Latest

Mesoblast (ASX: MSB) clears key treatment milestone ahead of mid-2027 back pain trial readout

Santos (ASX: STO) warns Australia’s 20% gas reservation rule could undermine GLNG economics

Russian missiles strike Kyiv as attacks injure 17 in Zaporizhzhia and Kharkiv

Regis Resources (ASX: RRL) drops Vault Minerals bid, letting Genesis Minerals’s A$5.6bn offer proceed

Representative image of liquid-cooled AI server hardware inside a hyperscale data center, illustrating the type of direct-to-chip cooling infrastructure being developed through the Flex and Broadcom collaboration to support next-generation AI XPUs and high-density artificial intelligence workloads.

Read More

Technology Industry News

AI chips are overheating. Can Flex and Broadcom fix the cooling crisis?

Flex and Broadcom collaborate on liquid cooling for next-generation AI XPUs. Discover why cooling technology may become the key constraint in hyperscale AI infrastructure.

March 11, 2026

web analytics