Browsing Tag
Charlie Kawwas
2 posts
Samsung Electronics and Broadcom sign $200bn memory and foundry MOU through 2030
Samsung and Broadcom's $200 billion MOU spans HBM, 2nm foundry and 2.5D packaging through 2030, testing whether Samsung can close TSMC's 2nm lead in time.
What OpenAI’s Jalapeño chip says about the next phase of AI infrastructure competition
OpenAI’s Jalapeño chip gives Broadcom a deeper role in custom AI silicon, inference infrastructure and AVGO’s trillion-dollar growth narrative.