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Representative image of liquid-cooled AI server hardware inside a hyperscale data center, illustrating the type of direct-to-chip cooling infrastructure being developed through the Flex and Broadcom collaboration to support next-generation AI XPUs and high-density artificial intelligence workloads.

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AI chips are overheating. Can Flex and Broadcom fix the cooling crisis?

Flex and Broadcom collaborate on liquid cooling for next-generation AI XPUs. Discover why cooling technology may become the key constraint in hyperscale AI infrastructure.

March 11, 2026

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