Intel unveils Fab 9 in New Mexico: A leap in semiconductor packaging technology

In a significant advancement for the semiconductor industry, Intel celebrated the opening of Fab 9, its state-of-the-art factory located in Rio Rancho, New Mexico. This development is part of Intel’s ambitious $3.5 billion investment aimed at enhancing its New Mexico operations. The investment focuses on the manufacturing of advanced semiconductor packaging technologies, including the revolutionary 3D packaging technology known as Foveros. This technology offers unprecedented flexibility for combining multiple chips in a single package, optimizing power, performance, and cost, and reinforcing a resilient supply chain.

Keyvan Esfarjani, Intel’s Executive Vice President and Chief Global Operations Officer, emphasized the uniqueness of Fab 9, stating, “Today, we celebrate the opening of Intel’s first high-volume semiconductor operations and the only U.S. factory producing the world’s most advanced packaging solutions at scale.” Esfarjani highlighted the competitive edge this technology provides to Intel and its customers, offering significant advantages in performance, design flexibility, and supply chain resilience.

Why Fab 9 Matters:

Intel’s global factory network stands as a formidable competitive advantage, enabling product optimization, improved economies of scale, and enhanced supply chain resilience. Fab 9, alongside Fab 11x in Rio Rancho, marks Intel’s inaugural site for the mass production of its 3D advanced packaging technology. This co-location of high-volume advanced packaging facilities signifies an integrated manufacturing process that streamlines the supply chain from demand forecasting to product delivery.

The semiconductor industry is venturing into an era of heterogeneity, where packages comprise multiple “chiplets.” In this landscape, Intel’s advanced packaging technologies like Foveros and EMIB (embedded multi-die interconnect bridge) play a crucial role. These technologies enable a faster, more cost-efficient route to achieving a trillion transistors on a chip, thereby extending Moore’s Law beyond 2030.

Foveros is particularly groundbreaking, as it allows for vertical stacking of compute tiles, offering an innovative approach to processor design. This enables Intel and its foundry customers to customize compute tiles for optimal cost and power efficiency.

Intel’s Economic and Environmental Impact in New Mexico:

Governor Michelle Lujan Grisham lauded Intel’s investment as a testament to New Mexico’s commitment to revitalizing American manufacturing. Intel’s investment has not only bolstered the state’s technology sector but also supported thousands of local families through the creation of high-tech jobs and thousands more in construction and related fields.

Intel is also dedicated to corporate responsibility, particularly in minimizing its environmental impact. Fab 9 aims to recycle at least 90% of its construction waste, a goal it has already surpassed. Moreover, Intel meets all its New Mexico operations’ electricity needs with renewable sources.

The company’s involvement in water restoration projects in New Mexico underscores its commitment to sustainability, having restored more than 100% of its freshwater usage back to the community and local watersheds in 2022.

Intel’s unveiling of Fab 9 in New Mexico represents a pivotal moment in semiconductor manufacturing, setting new standards in the industry for advanced packaging technologies. Through its significant investment, Intel not only underscores its leadership in technological innovation but also its commitment to environmental sustainability and economic development. Fab 9’s operationalization is a stride towards meeting the escalating demand for semiconductors, ensuring a robust, efficient, and sustainable supply chain that will fuel technological advancements for years to come.