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Srinath

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Business News Today infographic showing VisionPower Semiconductor Manufacturing Company’s new 300mm Singapore fab, including 130nm-to-40nm process technologies, risk production underway, commercial volume production targeted for Q1 2027 and planned capacity of about 44,000 wafers per month by 2029.
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AI uses cutting-edge GPUs, so why is NXP investing in 40nm to 130nm chips on 300mm wafers?

VisionPower Semiconductor Manufacturing Company’s new Singapore fab will produce 40nm to 130nm specialty chips on 300mm wafers rather than leading-edge processors. The investment highlights a less-publicised semiconductor transition in which mature-node analog, power-management and mixed-signal devices are adopting larger wafers to improve cost, capacity and supply resilience.