Filtronic secures $4.2m deal for pioneering satellite comms equipment
Filtronic plc (AIM: FTC), a prominent designer and manufacturer catering to the aerospace, defence, telecoms infrastructure, and space sectors, has clinched a new $4.25m (£3.4m) contract with a top-tier global provider in the low earth orbit (LEO) satellite communications equipment domain.
Under this lucrative deal, revenues from which are projected for recognition in FY 2024, Filtronic is slated to deliver its state-of-the-art Cerus32 solid state power amplifier (SSPA) module. This cutting-edge module will be coupled with a specially tailored control board. The spotlight is on these SSPA modules, which will find their place in strategic ground station spots during the second round of the customer’s earth station antenna roll-out. This deployment’s prime objective? To guarantee seamless E-band connectivity to the freshly unveiled E-band enabled LEO satellites. Notably, this initiative marks a groundbreaking moment as it represents the debut of high bandwidth E-band frequencies’ commercial use in a global LEO space setting.
The Cerus Power Module, a proud Filtronic innovation, boasts the firm’s exclusive MMIC chip design and patented power combining methods. The result? An amplifier module that’s not only compact but offers scalable output powers, ranging from 4W to a whopping >10W at E-band frequencies. Filtronic’s synergy with the client’s design team has led to the evolution from the initial Cerus16 SSPA to the enhanced Cerus32 SSPA. This module is tailored for straightforward field deployment and potential performance enhancements. The Cerus series, in its entirety, extends multiple power levels apt for the diverse frequency bands imperative for the burgeoning LEO space applications.
On this significant milestone, Richard Gibbs, Filtronic’s CEO, expressed his enthusiasm. He emphasized the company’s elation in extending its partnership with a global frontrunner in LEO space solutions. Gibbs also highlighted the client’s choice of the Cerus32 module for the next phase, praising its superior performance in a more compact and scalable design. He further hinted at the exciting prospects of amplifying output powers as the next-gen compound semiconductor tech rolls out later this year.