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Representative image of liquid-cooled AI server hardware inside a hyperscale data center, illustrating the type of direct-to-chip cooling infrastructure being developed through the Flex and Broadcom collaboration to support next-generation AI XPUs and high-density artificial intelligence workloads.

AI chips are overheating. Can Flex and Broadcom fix the cooling crisis?

Why FERM FOOD is acquiring Orkla’s Skovlund factory to meet faster-than-expected global fermentation demand

Inside Galderma’s €500m bond deal and what it reveals about the dermatology market’s financial momentum

From Eli Lilly to Hims & Hers: what Kathryn Beiser’s move says about the telehealth platform’s ambitions

PayPal files for industrial bank charter to expand lending access for U.S. small businesses

Find out how PayPal’s industrial bank charter application could expand lending and deposit services for U.S. small businesses and reshape fintech competition.

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December 16, 2025