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Representative image of liquid-cooled AI server hardware inside a hyperscale data center, illustrating the type of direct-to-chip cooling infrastructure being developed through the Flex and Broadcom collaboration to support next-generation AI XPUs and high-density artificial intelligence workloads.

AI chips are overheating. Can Flex and Broadcom fix the cooling crisis?

Why FERM FOOD is acquiring Orkla’s Skovlund factory to meet faster-than-expected global fermentation demand

Inside Galderma’s €500m bond deal and what it reveals about the dermatology market’s financial momentum

From Eli Lilly to Hims & Hers: what Kathryn Beiser’s move says about the telehealth platform’s ambitions

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Technology Industry News

Step into the future: Wipro and Google Cloud introduce Google Gemini Experience Zones

Wipro Limited, in collaboration with Google Cloud, has launched the Google Gemini Experience Zone, a high-tech space designed…

byPallavi Madhiraju

November 12, 2024

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