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Representative image of liquid-cooled AI server hardware inside a hyperscale data center, illustrating the type of direct-to-chip cooling infrastructure being developed through the Flex and Broadcom collaboration to support next-generation AI XPUs and high-density artificial intelligence workloads.

AI chips are overheating. Can Flex and Broadcom fix the cooling crisis?

Why FERM FOOD is acquiring Orkla’s Skovlund factory to meet faster-than-expected global fermentation demand

Inside Galderma’s €500m bond deal and what it reveals about the dermatology market’s financial momentum

From Eli Lilly to Hims & Hers: what Kathryn Beiser’s move says about the telehealth platform’s ambitions

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Auto and Transport Industry News

Indian auto component manufacturer Minda appoints Ranjit Nambiar as CEO

Minda Corporation Limited, an Indian auto component manufacturer, said that it has appointed Ranjit Nambiar as the Chief…

September 12, 2021

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