Browsing Tag
chiplet packaging
2 posts
Can KrF lasers unlock high-precision AI packaging? Gigaphoton’s bet explained
Gigaphoton’s G300K laser is enabling Japan’s chiplet-based AI packaging race. Discover how the excimer system supports precision via drilling and advanced substrates.
ASMPT and IBM to enhance chiplet packaging with next-gen bonding technologies
ASMPT and IBM (NYSE: IBM) have announced an extension of their collaboration aimed at revolutionising chiplet packaging technologies.…