Browsing Tag
ASML
12 posts
IBM debuts world’s first sub-1 nanometer chip technology, pushing logic scaling into the angstrom era
IBM debuts the world's first sub-1nm chip with nanostack 3D architecture, 100 billion transistors and a five-year production path. Read the full analysis.
June 26, 2026
Scottish Mortgage (LSE: SMT) delivers 27.4% NAV return as SpaceX nears IPO and AI buildout reshapes the portfolio
Scottish Mortgage returns 27.4% as SpaceX swells past 19% of assets and shares jump to a 52-week high premium, turning SMT into a leveraged bet on one IPO.
May 27, 2026
Leap Scholar data shows Singapore overtaking traditional markets as Indian students pivot to AI-led degrees
Singapore now ranks second in Indian student study-abroad conversations as AI and data science overtake legacy master's choices, Leap Scholar data shows.
May 20, 2026
ASML to equip Tata Electronics’ $11bn Dholera fab as India’s first 300 mm plant nears ramp
India's first commercial 300 mm fab had everything except lithography. Tata Electronics just signed ASML, the only company that could complete the stack.
May 16, 2026
The Turnberry Agreement: Inside the asymmetric United States and European Union trade framework now under strain
Brussels accepted a 15 per cent tariff ceiling for stability. Trump just breached it. The Turnberry Agreement was the floor, not the deal.
May 3, 2026
Scottish Mortgage (LSE: SMT): Is the 23% NAV rebound the start of a new upcycle?
Scottish Mortgage Investment Trust posts a 22.9% NAV gain in H1 FY26. Explore key drivers, new tech bets, and investor sentiment trends behind the turnaround.
November 8, 2025
SK hynix stock surges 7% as it unveils world’s first HBM4 mass production and NAND breakthrough
SK hynix stock jumped 7% after unveiling the world’s first HBM4 mass production system and high-performance ZUFS 4.1 NAND launch. Find out what this means for AI memory innovation.
September 12, 2025
Lam Research launches Vector Teos 3D to tackle chiplet packaging challenges in the AI and HPC era
Lam Research (NASDAQ: LRCX) unveils Vector Teos 3D, a breakthrough chiplet packaging tool designed to power next-gen AI and HPC semiconductor growth.
September 10, 2025
Applied Materials warns of sharp Q4 slowdown as China demand falters and export curbs bite
Applied Materials beat Q3 estimates but warned of a Q4 revenue slump on weak China demand and export curbs. Read why shares plunged 13%.
August 15, 2025
Nvidia stock sinks as Trump’s China chip ban triggers $5.5bn blow to AI giant
Nvidia warns of a $5.5B revenue hit as Trump-era China chip export rules expand. Explore how this reshapes AI chip markets and Nvidia's global strategy.
April 16, 2025