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ASML

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High-NA EUV lithography is moving into advanced semiconductor manufacturing, where next-generation chipmaking systems could reduce multi-patterning steps, cut mask complexity and support smaller features for future processors. Representative image.
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High-NA EUV lithography: How fewer masks could reshape advanced chip manufacturing

High-NA EUV lithography has moved from semiconductor research into real chip manufacturing. Intel Foundry is using ASML’s 0.55 numerical-aperture technology on selected Intel 18A layers for Panther Lake processors, while imec is installing a second-generation system to develop future logic and memory processes. The attraction goes beyond smaller features: High-NA could collapse several masks and patterning steps into a single exposure on some critical layers, potentially reducing cycle time, defects and manufacturing complexity.