ASMPT and IBM to enhance chiplet packaging with next-gen bonding technologies
ASMPT and IBM (NYSE: IBM) have announced an extension of their collaboration aimed at revolutionising chiplet packaging technologies. This renewed agreement will see both companies pushing the boundaries of thermocompression and hybrid bonding technology using ASMPT’s latest Firebird TCB and Lithobolt hybrid bonding tools. Revamping Chiplet Packaging for Next-Generation AI The latest partnership between ASMPT […]