ASMPT and IBM to enhance chiplet packaging with next-gen bonding technologies
ASMPT and IBM (NYSE: IBM) have announced an extension of their collaboration aimed at revolutionising chiplet packaging technologies. This renewed agreement will see both companies ... Read More
Samsung Electronics partners with preferred networks to develop advanced AI semiconductor solutions
Samsung Electronics, a global leader in semiconductor technology, has announced a significant partnership with Preferred Networks, a top Japanese AI company. This collaboration will see ... Read More