Samsung unveils world’s first 32Gb DDR5 DRAM: A game-changer for AI and Big Data

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Samsung Electronics Co., Ltd., a global frontrunner in advanced memory technology, has just announced a groundbreaking development: the industry’s first 32-gigabit (Gb) DDR5 DRAM using 12-nanometer (nm)-class process technology. This monumental achievement solidifies Samsung’s unassailable lead in next-generation DRAM technology and marks a seismic shift in the world of high-capacity memory.

This announcement follows hot on the heels of Samsung’s mass production of its 12nm-class 16Gb DDR5 DRAM in May 2023. “With our 12nm-class 32Gb DRAM, we are perfectly positioned to meet the escalating demand for high-capacity DRAM in the AI and big data sectors,” declared SangJoon Hwang, Executive Vice President of DRAM Product & Technology at Samsung Electronics. Samsung is not just breaking new ground; it’s shattering existing limitations of memory technology.

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The evolution has been rapid and remarkable. Since its first 64-kilobit (Kb) DRAM in 1983, Samsung has magnified its DRAM capacity by a staggering factor of 500,000 in just 40 years. Samsung’s latest memory marvel, achieved through state-of-the-art integration density and design optimization, has the highest capacity for a single DRAM chip ever. The 32Gb DDR5 DRAM offers double the capacity in the same package size as its 16Gb predecessor.

How Samsung Electronics’ Revolutionary 32Gb DDR5 DRAM Could Reshape the Future of Computing

How Samsung Electronics’ Revolutionary 32Gb DDR5 DRAM Could Reshape the Future of Computing. Photo courtesy of Business Wire.

Samsung’s technological prowess extends beyond just capacity. Earlier, the production of 128GB DDR5 DRAM modules using 16Gb DRAM necessitated the Through Silicon Via (TSV) process. However, Samsung’s new 32Gb DDR5 DRAM eliminates the need for the TSV process and, astoundingly, cuts down power consumption by about 10%. This makes it an ideal choice for power-sensitive sectors like data centers.

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Going forward, Samsung has ambitious plans to diversify its high-capacity DRAM product line to meet the insatiable demands of the computing and IT industry. Mass production of this groundbreaking 32Gb DDR5 DRAM will commence by the year’s end, targeting not just data centers but also other applications requiring next-generation computing and AI capabilities.

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In summary, Samsung’s newest 12nm-class 32Gb DDR5 DRAM isn’t just another product release—it’s a seminal moment in the world of advanced memory technology, setting new benchmarks in capacity and power efficiency. With this revolutionary product, Samsung is once again setting the pace for the future of the industry.

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