Onto Innovation boosts semiconductor yields with 3Di and EchoScan systems
Onto Innovation Inc. has unveiled transformative advancements in 3D interconnect process control, a critical aspect of next-generation semiconductor manufacturing. The introduction of 3Di technology on the Dragonfly G3 system and the new EchoScan void detection system marks a significant leap in addressing the challenges of high-bandwidth memory (HBM) and hybrid bonding. These technologies are designed to enable greater yields and reliability in high-volume manufacturing (HVM), ensuring the semiconductor industry meets the demands of advanced logic applications and evolving hybrid bonding technology.
Addressing Challenges in 3D Interconnect Yields
The semiconductor industry is under constant pressure to enhance 3D interconnect yields as devices demand higher performance and efficiency. With the adoption of hybrid bonding, interconnect density has increased, leading to smaller bump sizes and the emergence of new challenges. Interconnect bump heights in HVM have decreased from 12µm to 8µm, with projections indicating potential reductions to 4µm. As these dimensions shrink, the need for advanced metrology and process control tools becomes paramount.
Onto Innovation’s 3Di technology addresses this by enabling precise control over bump dimensions, catering to the stringent requirements of HBM and GPU devices. According to Mike Rosa, the company’s chief marketing officer and senior vice president of strategy, this innovation supports applications requiring bump sizes as small as 5µm in production environments and even 2µm in research and development.
The Role of EchoScan in Void Detection
Void detection has become a critical focus for achieving high 3D interconnect yields. Hybrid bonding processes, which rely on Cu-Cu interconnects, face risks such as wafer cracking, contamination, and open electrical connections when voids remain undetected. Traditional detection technologies are limited to voids measuring ≥10µm and often require immersion-based methods, which introduce contamination and delamination risks.
Onto Innovation’s EchoScan system offers a groundbreaking solution with non-contact, immersion-free void detection for voids as small as 1µm. By eliminating water immersion, the EchoScan system reduces contamination risks while improving traceability in inline process control. This advancement ensures manufacturers can reliably detect and address potential issues in real time, enabling higher yields and enhanced process reliability.
Driving Growth in Advanced Packaging
The semiconductor industry is poised for rapid growth in advanced packaging, with 2.5D and 3D integration schemes projected to grow by 19% annually from 2024 to 2028, as noted by TechInsights. These technologies are crucial for supporting the increasing demands of AI-driven applications, which rely on high-performance GPUs and HBMs.
Onto Innovation’s contributions to this sector extend beyond void detection. Its integrated portfolio of technologies includes unpatterned wafer quality assessment, 3D metrology, macro defect inspection, and lithography for advanced semiconductor packaging. This comprehensive approach enables the company to address challenges across the entire semiconductor value chain, empowering manufacturers to meet the demands of next-generation devices.
Enabling Real-Time Feedback with Discover Software
A key differentiator in Onto Innovation’s offerings is the integration of its Discover analytical software with the 3Di and EchoScan systems. This platform facilitates real-time defect analysis and provides immediate feedback to process tools, streamlining statistical process control. By enabling rapid yield loss assessment, the software helps manufacturers optimize production cycles and improve overall process efficiency.
Rosa highlighted that the combination of Discover software and EchoScan technology offers unmatched precision in high-volume manufacturing environments. This integration ensures that manufacturers can maintain process stability and achieve their production goals while reducing waste and improving cost efficiency.
A Commitment to Innovation and Excellence
Headquartered in Wilmington, Massachusetts, Onto Innovation has established itself as a leader in advanced process control solutions. The company’s commitment to innovation is reflected in its broad portfolio, which spans wafer metrology, factory analytics, and defect inspection technologies. With a strong global sales and service network, Onto Innovation is well-positioned to support its customers in overcoming the complexities of modern semiconductor manufacturing.
As the semiconductor industry continues to evolve, Onto Innovation’s focus on precision, reliability, and efficiency ensures it remains at the forefront of technological advancements. By addressing the challenges of hybrid bonding and interconnect density, the company is paving the way for the next generation of semiconductor devices.
Discover more from Business-News-Today.com
Subscribe to get the latest posts sent to your email.