Electroninks launches game-changing Copper MOD Ink for semiconductor packaging

Electroninks, a leading force in the metal organic decomposition (MOD) ink sector, has introduced its new copper MOD ink, a development poised to revolutionize semiconductor packaging. Announced at SEMICON Taiwan 2024, the new copper ink promises to deliver unparalleled benefits in production speed, cost efficiency, and environmental sustainability. This launch is being showcased at booth Q5152 in Hall 2.

The copper MOD ink is engineered to replace traditional electroless copper plating and physical vapor deposition (PVD) processes. It offers several key advantages: enhanced manufacturing throughput, reduced environmental impact, and cost efficiency. By significantly speeding up production cycles and minimizing water and energy usage, as well as factory footprint and capital expenditures, the copper ink provides the lowest total cost of ownership and highest return on investment (ROI) in the industry.

Versatility is a hallmark of the new copper MOD ink. It supports various printing techniques such as spray coating, screen printing, inkjet printing, and spin-on methods. This flexibility extends its application beyond seed layer printing for fine-line metallization and redistribution layer (RDL) formation. The ink adheres to multiple substrates including glass, silicon, and epoxy molding compounds (EMC), and it cures at low temperatures, as low as 140°C in just 5 minutes under nitrogen or ambient conditions.

Brett Walker, CEO and co-founder of Electroninks, highlighted the strategic significance of this innovation, stating, “This launch enhances Electroninks’ position as a leader in the MOD ink market. Our copper ink delivers superior environmental performance and cost savings, setting new benchmarks for the industry.” Jim Haley, Vice President of Marketing at IMAPS and Executive Council member, noted the importance of the copper-based MOD ink, stating, “MOD inks have been instrumental in meeting the demands of advanced semiconductor packages. The introduction of copper-based MOD ink addresses key needs in advanced packaging, with copper being a standard material in electronic design.”

The introduction of copper MOD ink aligns with current industry trends toward greater efficiency and sustainability in semiconductor manufacturing. This development not only supports more efficient production but also advances the industry’s move toward environmentally responsible practices.