BAE Systems secures $22m contract to advance microelectronics for U.S. Defense

BAE Systems’ FAST Labs Research and Development division has been awarded a significant $22 million contract by the Office of the Undersecretary of Defense for Research & Engineering. This contract, facilitated through the Naval Surface Warfare Center (NSWC) Crane Division’s Strategic & Spectrum Missions Advanced Resilient Trusted Systems (S2MARTS) Other Transaction Agreement (OTA) vehicle, will fund the Strategic Transition of Microelectronics to Accelerate Modernization by Prototyping and Innovating in the Packaging Ecosystem (STEAM PIPE) project. The project will be overseen by the National Security Technology Accelerator (NSTXL) and aims to enhance U.S. defense capabilities through advanced microelectronics.

The STEAM PIPE project will focus on developing and delivering advanced chiplet prototypes, which are crucial for modernizing military systems. Microelectronics, essential for the Department of Defense’s (DoD) technological advancement, play a vital role in enhancing warfighting capabilities. BAE Systems’ initiative will create a new chiplet ecosystem, potentially leading to innovations such as smaller and more efficient electronic warfare technology on advanced platforms.

Wes Allen, Director of Microelectronics at BAE Systems’ FAST Labs, explained that chiplets are small, modular components that can be combined to form complex systems-on-a-chip. He highlighted that this project represents the inception of a new chiplet ecosystem, which could lead to significant breakthroughs in technology.

The STEAM PIPE project builds on recent technological advancements and follows a milestone achievement in the State-of-the-Art Heterogeneous Integrated Packaging (SHIP) program. This initiative also involves collaboration with key subcontractors Extoll GmbH and Comcores ApS, who will contribute to the development and innovation of the chiplet technology.

This contract underscores the increasing importance of advanced microelectronics in national defense and reflects the ongoing efforts to integrate cutting-edge technology into military systems. The chiplet prototypes developed through this project will eventually be available to the broader U.S. defense industrial base, fostering innovation and modernization across the sector.

The strategic focus on microelectronics through the STEAM PIPE project is expected to drive significant advancements in defense technology. By enhancing the capabilities of microelectronic systems, the project aims to provide the U.S. military with more sophisticated and adaptable technologies, ultimately improving national security and defense readiness.

The collaboration between BAE Systems, NSWC Crane Division, and subcontractors is poised to yield substantial benefits, aligning with the DoD’s objectives to stay ahead in technological advancements and maintain a strategic edge in defense capabilities.