VL E-Governance signs MOU with Wafer Lead for advanced semiconductor collaboration

In a move poised to revolutionize the semiconductor sector, VL E-Governance & IT Solutions Limited, a wholly owned subsidiary of Vakrangee Limited, has forged a significant Memorandum of Understanding with Wafer Lead Pte Ltd., a Singapore-based entity known for its semiconductor wafer fabrication and design engineering prowess.

A Strategic Partnership in Advanced Semiconductor Development

The collaboration is expected to impact several high-stake sectors, including aerospace, defense, automotive, and power electronics, with both parties agreeing to share scientific, technical, and commercial information. This synergy aims at leveraging Silicon Carbide, a third-generation semiconductor material that is becoming crucial for advanced technology infrastructure development and investment.

VL E-Governance & IT Solutions and Wafer Lead Pte Chart a Collaborative Future

Under the terms of the MOU, VL E-Governance & IT Solutions will co-lead multiple critical areas: technology, design, engineering, and manufacturing, as well as project management, business development, contract management, and regulatory compliance. The integration of intellectual property rights owned by each entity is expected to streamline Silicon Carbide based methodologies, device innovation, and manufacturing process technologies.

Expanded Semiconductor Expertise with Global Implications

Wafer Lead Pte Ltd., in alignment with United Monolithic Semiconductors (UMS) and CM Engineering Labs, Singapore Pte. Ltd. (CMLS), is committed to advancing RF circuits and RF Transmit/Receive modules. The collaboration, solidified on October 16, 2023, seeks to accelerate the design, manufacturing, sales, and investment in next-gen GaN (gallium nitride) and GaAs (gallium arsenide) based electronic devices and technologies, fostering a robust ecosystem for semiconductor advancements.

The joint efforts underscore a landmark cooperative endeavor in designing, manufacturing, and investment in areas that could redefine the semiconductor landscape, particularly in domains requiring high-performance components.