Nanoveu to acquire semiconductor firm EMASS to enhance 3D technology and expand into AI markets

Nanoveu to acquire semiconductor firm EMASS to enhance 3D technology and expand into AI markets

Nanoveu Limited, listed on the ASX under the ticker NVU, has announced a groundbreaking acquisition of Embedded A.I. Systems Pte. Ltd (EMASS), a prominent player in the system-on-a-chip (SoC) semiconductor sector. This strategic move aims to integrate EMASS’s cutting-edge SoC technology into Nanoveu’s flagship platform, EyeFly3DTM, and marks a significant milestone in expanding Nanoveu’s reach […]

DARPA awards $12m contract to BAE Systems for THREADS program

DARPA awards $12m contract to BAE Systems for THREADS program

The Defense Advanced Research Projects Agency (DARPA) has awarded a $12 million contract to BAE Systems’ FAST Labs research and development organization. This contract is part of the Technologies for Heat Removal in Electronics at the Device Scale (THREADS) program. The program aims to address thermal management challenges at the transistor scale, particularly for power-amplifying […]

Nokia Bell Labs to pioneer LunA-10 program for Lunar Economy with DARPA

Nokia Bell Labs to pioneer LunA-10 program for Lunar Economy with DARPA

In an ambitious move that harks back to the pioneering days of space exploration, Nokia Bell Labs has been selected by the U.S. Defense Advanced Research Projects Agency (DARPA) to participate in the LunA-10 program. This groundbreaking initiative aims to design an integrated multi-service architecture to support a thriving lunar economy in the next decade […]