In a significant development in the semiconductor industry, SK hynix Inc. has announced a strategic memorandum of understanding with Taiwan Semiconductor Manufacturing Company (TSMC) aimed at enhancing the production capabilities of High Bandwidth Memory (HBM) through advanced packaging technologies. This collaboration is set to focus on the development of HBM4, the sixth generation of HBM technology, with mass production expected to commence in 2026.

The partnership between SK hynix, a leader in AI memory solutions, and TSMC, a top global logic foundry, is poised to drive substantial advancements in HBM technology. This initiative is expected to not only improve memory performance but also pioneer new integrations in product design, foundry operations, and memory provision through a trilateral collaborative approach.

Key to this collaboration is the enhancement of the base die technology, crucial in HBM structure, where a core DRAM die is stacked above a base die utilizing Through Silicon Via (TSV) technology. The base die, vital for connecting the DRAM stack to GPUs controlling the HBM, will transition to TSMC’s advanced logic processes in the upcoming HBM4, promising increased functionality within the constrained spatial configurations typical of modern tech applications.

Furthermore, both companies have committed to optimizing the integration of SK hynix’s HBM with TSMC’s proprietary Chip on Wafer on Substrate (CoWoS) technology. This integration focuses on facilitating advanced 2.5D packaging, where the logic chip and vertically stacked HBM are combined into a unified module, enhancing the performance and efficiency of AI solutions.

Justin Kim, President and Head of AI Infrastructure at SK hynix, highlighted the collaboration’s role in accelerating open customer collaborations and strengthening SK hynix’s position in the custom memory platform space. Dr. Kevin Zhang of TSMC echoed these sentiments, noting the longstanding partnership’s pivotal role in integrating cutting-edge logic with state-of-the-art HBM to lead the AI solutions sector.

This partnership marks a significant milestone for the semiconductor industry, showcasing how strategic collaborations can enhance technological capabilities and meet growing market demands. The focus on advanced memory solutions not only supports the burgeoning AI technology landscape but also sets a new standard for memory performance and integration across various applications.

  advanced packaging technology, AI memory solutions, HBM4, High Bandwidth Memory, Semiconductor Industry, SK hynix Inc, TSMC