Rapidus Corporation, a pioneering manufacturer in advanced logic semiconductors, has entered into a significant joint development partnership with multinational technology giant IBM (NYSE: IBM). This collaboration aims to establish innovative mass production technologies for chiplet packages, enhancing the capabilities and performance of semiconductors. The partnership is part of a larger initiative spearheaded by Japan’s New Energy and Industrial Technology Development Organization (NEDO) to advance chiplet and package design and manufacturing technologies for 2nm-generation semiconductors.

Strategic Collaboration and Technological Advancements

Under the terms of the agreement, IBM will provide Rapidus with advanced packaging technology tailored for high-performance semiconductors. The collaboration will leverage IBM’s extensive experience and facilities in North America, where engineers from both companies will work together to research and develop state-of-the-art semiconductor packaging solutions. This initiative builds on an existing collaboration between the two companies focused on developing 2nm node technology.

Expert Insights from Company Leaders

Dr. Atsuyoshi Koike, President and CEO of Rapidus, expressed enthusiasm about the partnership, stating, “Building on our current joint development agreement for 2nm semiconductor technology, we are extremely pleased to officially announce today this partnership with IBM to establish chiplet packaging technology.” He emphasized the importance of this international collaboration in reinforcing Japan’s role in the global semiconductor packaging supply chain.

Darío Gil, SVP and Director of Research at IBM, also commented on the collaboration: “With decades of innovation in advanced packaging, IBM is honored to expand our collaboration with Rapidus to develop state-of-the-art chiplet technology.” He highlighted IBM’s commitment to supporting the development of advanced production processes, design, packaging, and new use cases for semiconductors.

Implications for the Semiconductor Industry

This partnership between Rapidus and IBM is expected to accelerate the development of cutting-edge semiconductor technologies, which are crucial for the evolution of high-performance computing systems. By combining IBM’s technological expertise and Rapidus’s innovative approaches, the collaboration is poised to make significant advancements in semiconductor design and functionality.

Future Prospects

The collaboration is not only a step forward in advancing semiconductor technology but also supports the broader goals of enhancing the semiconductor workforce and establishing more resilient supply chains. It positions both IBM and Rapidus at the forefront of the next generation of semiconductor technology, with potential impacts across various high-tech industries.

  advanced manufacturing, chiplet packaging technology, high-performance semiconductors, IBM, NEDO project, Rapidus Corporation, semiconductor technology, Technology Collaboration