Lockheed Martin (NYSE: LMT) has embarked on a major project in collaboration with Intel Corporation (Nasdaq: INTC) and Altera, an Intel Company, to support the Office of the Under Secretary of Defense for Research and Engineering (OUSD R&E)’s Stimulating Transition for Advanced Microelectronics Packaging (STAMP) program. This initiative aims to develop a low size, weight, and power (SWaP), Sensor Open Systems Architecture (SOSA) aligned airborne electronic defense system. Leveraging Altera’s Multi-Chip Package (MCP2), the technology is anticipated for deployment on the U.S. Navy’s MH-60R multi-mission helicopter. The Naval Surface Warfare Center (NSWC) Crane Division’s Strategic & Spectrum Missions Advanced Resilient Trusted Systems (S2MARTS) Other Transaction Agreement (OTA) vehicle facilitated this partnership, with management by the National Security Technology Accelerator (NSTXL).

Deon Viergutz, Vice President of Spectrum Convergence at Lockheed Martin, highlighted the importance of this collaboration: “We are excited to work with Intel, Altera, and OUSD to provide a revolutionary leap in defense systems capabilities, utilizing high-performance U.S.-built semiconductors.” He underscored the project’s significance in evolving legacy systems and developing new technologies to ensure the safety of service members by mastering the electromagnetic spectrum and staying ahead of threats.

John Sotir, Senior Director at Altera, emphasized the impact of their technology: “The Multi-Chip Package (MCP2) based on Altera’s Agilex™9 SoC FPGA Direct RF-Series is the latest example of how we’re delivering industry-leading products via our chiplet technology.” Sotir explained that the collaboration facilitates the rapid development of vital defense systems, offering higher bandwidth and performance with low latency in a smaller footprint.

As part of the STAMP program, Lockheed Martin aims to enhance technology to detect and identify threats with greater speed and accuracy, all while significantly reducing SWaP and costs. This not only frees up space for other mission-critical equipment but also extends the technology’s application across various platforms, including air, land, and sea. The integration of Lockheed Martin’s latest SOSA technology with Altera’s semiconductors is expected to lead to the implementation, testing, and completion of production through the U.S. Navy’s MH-60R helicopter program within the next 18 months.

This partnership signifies a major step forward in defense technology, combining Lockheed Martin’s expertise in defense systems with Intel and Altera’s advancements in semiconductor technology. The project’s focus on reducing SWaP without compromising performance could revolutionize the efficiency and effectiveness of military hardware, making it a pivotal development in the defense sector.

  Altera, defense technology advancement, Intel Corporation, Lockheed Martin, MCP2, semiconductor technology, SOSA aligned airborne electronic defense system, STAMP program, U.S. Navy MH-60R helicopter