Intel Corporation has made a significant breakthrough in integrated photonics technology, demonstrating the first-ever optical compute interconnect (OCI) chiplet co-packaged with an Intel CPU at the Optical Fiber Communication Conference (OFC) 2024.

The OCI chiplet, developed by Intel’s Integrated Photonics Solutions (IPS) Group, is designed to revolutionize high-bandwidth interconnects, particularly in data centers and high-performance computing (HPC) applications. This innovation is set to significantly enhance machine learning (ML) workload acceleration, a crucial component in AI infrastructure.

Thomas Liljeberg, senior director of Product Management and Strategy at IPS, highlighted the transformative potential of this technology: “The ever-increasing movement of data from server to server is straining the capabilities of today’s data center infrastructure, and current solutions are rapidly approaching the practical limits of electrical I/O performance. However, Intel’s groundbreaking achievement empowers customers to seamlessly integrate co-packaged silicon photonics interconnect solutions into next-generation compute systems. Our OCI chiplet boosts bandwidth, reduces power consumption and increases reach, enabling ML workload acceleration that promises to revolutionize high-performance AI infrastructure.”

The OCI chiplet supports 64 channels of 32 gigabits per second (Gbps) data transmission in each direction over up to 100 meters of fiber optics. This capability addresses the growing demands for higher bandwidth, lower power consumption, and longer reach in AI infrastructure. It also offers scalability for future CPU/GPU cluster connectivity and advanced compute architectures, such as coherent memory expansion and resource disaggregation.

AI-based applications, especially those involving large language models and generative AI, are rapidly advancing, necessitating substantial improvements in infrastructure. The OCI chiplet enables higher bandwidths, improved power efficiency, and longer reaches, which are essential for scaling AI/ML infrastructure to meet these increasing demands.

Intel has been a pioneer in silicon photonics for over 25 years, leveraging extensive internal research and innovation to deliver high-volume, reliable connectivity solutions to major cloud service providers. The company’s expertise in hybrid laser-on-wafer technology and direct integration enhances the performance and efficiency of its products, distinguishing Intel in the market.

Intel’s OCI chiplet is currently a prototype, with plans underway to co-package it with other system-on-chips (SoCs) as an optical I/O solution for select customers. This initiative not only reinforces Intel’s commitment to innovation but also sets the stage for future developments in the field.

Intel’s demonstration of the OCI chiplet at OFC 2024 marks a pivotal moment in the evolution of data transmission technologies. By pushing the boundaries of optical I/O solutions, Intel is addressing critical challenges in AI and HPC environments, promoting more sustainable and efficient data center operations. This development is expected to have a profound impact on the industry, encouraging further advancements in integrated photonics technology.

  Data Transmission, high-performance computing, High-Speed Data Transmission, Integrated Photonics, Integrated Photonics Technology, Intel Corporation, Intel OCI Chiplet, Optical Compute Interconnect