Intel selects Poland for $4.6bn semiconductor assembly and test facility

Intel has announced its selection of a site near Wrocław, Poland, for a new state-of-the-art semiconductor assembly and test facility.

The facility aims to address the increasing demand for assembly and test capacity anticipated by Intel by 2027. With an investment of up to $4.6 billion, the facility will have expandable capacity and is expected to employ approximately 2,000 Intel workers.

The construction is contingent upon approval from the European Commission, and design and planning will begin immediately.

The establishment of this facility, combined with Intel’s existing wafer fabrication facility in Leixlip, Ireland, and its planned facility in Magdeburg, Germany, will create an end-to-end leading-edge semiconductor manufacturing value chain in Europe. It is projected to foster additional ecosystem investments and innovation both in Poland and across the European Union.

Poland was chosen as the location for the site due to its favorable infrastructure, robust talent pool, and conducive business environment. The proximity of the new site to Intel’s planned wafer fabrication facility in Germany and its existing facility in Ireland will facilitate close collaboration among the three manufacturing sites, enhancing the resilience and cost efficiency of the European semiconductor supply chain.

Rendering of Intel’s $4.6bn semiconductor assembly and test facility in Poland. Image courtesy of Intel Corporation.

Poland Prime Minister Mateusz Morawiecki said: “We are pleased that the largest greenfield investment in the history of Poland is being led by Intel, a Silicon Valley legend known for its innovation. Chips and semiconductors are critical technologies in the 21st century and we are excited to expand Poland’s role in the global semiconductor supply chain and help to establish the country as an economic trendsetter.”

The new assembly and test facility will receive completed wafers from fabs, perform chip cutting, assemble final products, and conduct performance and quality testing. In addition to completed wafers, the facility will also handle individual chips, assembling them into final products. It will be capable of accepting wafers and chips from Intel, Intel Foundry Services, or other foundries.

The facility is expected to create well-paid permanent jobs, spanning engineering roles, business support functions, factory operators, and equipment technicians. Poland’s strong technical talent base, supported by excellent universities with robust engineering programs, played a crucial role in Intel’s decision.

The company has operated in Poland for 30 years, including significant research and development operations in Gdańsk, where its largest R&D facility in Europe employs nearly 4,000 workers.

Pat Gelsinger — Intel CEO said: “Poland is already home to Intel operations and is well positioned to work with Intel sites in Germany and Ireland. It is also very cost-competitive with other manufacturing locations globally and offers a great talent base that we are excited to help to grow.